Design Engineering Manager – Power Management

The Design Engineering Manager – Power Management will own the technical execution of advanced power management IC development, combining deep design expertise with engineering leadership. The role requires hands-on involvement in circuit design, architecture definition, validation, and mentoring to ensure successful product delivery.

• Define and architect high-voltage power management solutions, including gate drivers, intelligent power module protection circuits, and integrated silicon capacitor structures.
• Lead transistor-level analog and mixed-signal design, simulation, verification, and optimization of complex power semiconductor blocks.
• Drive the integration of passive silicon capacitor technologies into advanced multi-chip module and system-in-package architectures.
• Own key stages of the IC development lifecycle, from schematic design and layout supervision through tape-out execution.
• Partner with product and test engineering teams to characterize, debug, and validate first silicon through laboratory testing.
• Provide technical leadership, design reviews, mentorship, and guidance to junior and mid-level engineers.
• Collaborate with Device Engineering, System Applications, Packaging, and other cross-functional teams to align technical strategies and product requirements.
• Support continuous improvement of design methodologies, verification practices, and engineering processes.

Requirements:

The ideal candidate is an experienced semiconductor design leader with a strong background in analog and mixed-signal IC development, power management technologies, and production silicon delivery.

• Master’s or Ph.D. degree in Electrical Engineering or a related technical discipline.
• 7+ years of hands-on IC design experience with a demonstrated history of successful production tape-outs.
• Deep expertise in high-voltage gate driver architectures, level shifters, isolation techniques, and power management circuit design.
• Strong understanding of silicon capacitor fabrication processes, parasitic modeling, and high-frequency characterization methods.
• Advanced proficiency with EDA tools such as Cadence Virtuoso, Spectre, Mentor Calibre, and mixed-signal simulation environments.
• Strong laboratory debugging and validation skills using tools such as oscilloscopes, spectrum analyzers, and high-voltage testing equipment.
• Ability to provide technical leadership, mentor engineering teams, and communicate effectively with cross-functional stakeholders.
• Experience with GaN and SiC power FET driving requirements is preferred.
• Familiarity with advanced multi-chip module (MCM) packaging and System-in-Package (SiP) design is a plus.

Benefits:

• Competitive compensation package aligned with experience, technical expertise, and qualifications.
• Remote work flexibility.
• Opportunity to contribute to cutting-edge semiconductor technologies with significant industry impact.
• Collaboration with highly skilled engineering teams across multiple disciplines.
• Professional growth opportunities through technical leadership and innovation-focused projects.
• Exposure to advanced power management, silicon integration, and next-generation hardware development.
• Inclusive workplace environment focused on equal opportunity and professional development.